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Product name: IC substrate
Material: BT
Layers: 2layers
Copper:
Thickness: 0.25±0.03mm
Surface finishing: NiPdAu4U"
Soldermask:
Application: IC
SLP | |
Name: | SLP |
Material: | BT |
Thickness: | 0.25mm±0.03mm |
Layer: | 2L |
Line width and distance: | 0.05mm/0.075mm |
Hole copper thickness: | 25-28um |
Surface finished: | NiPdAu4U" |
Special technology | Grinding Leveling/Dry Film Solder Mask |
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SLP
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