If You Need World PCBA For Your Bussiness, Please Contact Us!
Type of PCB:
Number of layers:
Overall dimensions of PCB:
Final boards thickness:
Copper weight:
Surface finishing:
Plugging or Filling holes：
Soldermask:
Special technology:
Application:
Miniled substrate PCB | |
Name: | Miniled substrate PCB |
Material: | Mitsubishi HL832NXA |
Thickness: | 0.25mm |
Layer: | 4L |
Copper: | 18um |
Soldermask: | Taiyo AUS308 |
Surface finished: | NiPdAu |
Min.Line width | 50um |
Min.Line spacing: | 50um |
H-CELERITY PCB LIMITED has been investing in the field of IC substrate since 2009, mainly producing 2-8 layers of UDP IC Substrate, LGA IC Substrate, CSP IC Substrate, PBGA IC Substrate and other IC Substrate samples and mass production, for various semiconductor research and development enterprises to provide stable products, fast delivery, the best service
The IC Substrate Material:
Core | MGC | HL832NXA | 40 ，50 ，60 ，100 ，150 ，200… |
HL832NS,NS(LC),NSF | |||
Doosan | DS-7409HGB(S) | ||
DS-7409HGB(LE) | |||
Hitachi | MCL-E-679FGB(S) | ||
MCL-E-700G(R) | |||
Panasonic | R1515H,R1515E | ||
Prepreg | MGC | GHPL830NX-A | 25 ，30 ，40 ，50 ，60… |
GHPL830NS,NS(LC),NSF | |||
Hitachi | GEA-679FG(S) | ||
Panasonic | R1410E | ||
Solder Mask | Taiyo | Green:AUS308,AUS320 | 15+/-7@Cu<=15μm |
20+/-10 | |||
Black:EG23 | |||
Film Type:AUS410,SR1 | 25+/-10 | ||
Plugging Material | SAN-EI KAGAKU | PHP 900 Series |
IC Substrate Production Capacity:
Item | Specifications | ||
Material | Shengyi,BT,Mitsubishi,Doushan,Toshiba,LG,Ajinomoto Buildup Film(ABF) | ||
MASS Production | Samples Production | ||
Layer | 2-6layer | 2-10layer | |
Min Drilling | 100um | 100um | |
Bonding Finger | Min.Pitch | 105um | 95um |
Min.Width | 35um | 35um | |
Circuit Line | Min.Pitch | 95um | 25um |
Min.Width | 25um | 25um | |
Min.Spacing | 25um | 25um | |
Min.Weding ring | 80um | 80um | |
Min.Thickness | 2L | 100um | 100um |
4L | 300um | 200um | |
6L | 400um | 300um | |
Line to PAD/EDGE | 100um | 100um | |
Soldermask | Solder PAD | 50um | 50um |
Solder DAM | 80um | 70um | |
Thickness | 20+/-5um | 20+/-5um | |
Flatness | 5um | 5um | |
Surface Finish | Hard Gold | Ni: 5-15 µm,Au: 0.2-0.5 µm | Ni: 5-15 µm,Au: 0.2-2 µm |
Soft Gold | Ni: 5-15 µm,Au: 0.3-0.8 µm | Ni: 5-15 µm,Au: 0.3-2 µm | |
ENEPIG-WB | Ni: 3-8 µm,Pd: 0.1-0.2 µm,Au: 0.1-0.2 µm | Ni: 3-8 µm,Pd: 0.1-0.2 µm,Au: 0.1-2µm | |
ENEPIG-SMT | Ni: 3-8 µm,Pd: 0.05-0.15 µm,Au: 0.05-0.15 µm | Ni: 3-8 µm,Pd: 0.05-0.15 µm,Au: 0.05-2 µm | |
OSP | OSP: 0.1-0.3 µm | OSP: 0.1-0.3 µm | |
We will contact you as soon as possible!
Miniled substrate PCB
Specialized in PCB & PCBA manufacture in CHIAN
Enter your email and we will contact you within 24 hours
English
