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Ceramic substrate board

Product Description

Ceramic Printed Circuit Boards (PCBs) by H-CELERITY PCB LIMITED

H-CELERITY PCB LIMITED specializes in the manufacture of high-quality Ceramic Printed Circuit Boards (PCBs), which are designed to meet the stringent demands of industries requiring exceptional thermal conductivity, electrical insulation, and mechanical stability. Our ceramic PCBs are engineered using state-of-the-art process technologies and materials to deliver unparalleled performance and reliability.

Key Technologies

  • Direct Bond Copper (DBC): This technology involves bonding a thin layer of copper directly onto a ceramic substrate using a high-temperature process. DBC is ideal for applications requiring high thermal conductivity and excellent electrical insulation, making it perfect for power electronics and high-power LED applications.

  • Direct Plated Copper (DPC): Utilizing photolithographic techniques, DPC allows for the precise deposition of copper layers on the ceramic substrate, enabling fine-line circuits and high-frequency performance. This technology is particularly useful in RF and microwave applications.

  • Active Metal Brazing (AMB): AMB utilizes brazing alloys to join copper to the ceramic substrate, allowing for the creation of complex structures and high-temperature applications. This technology is often used in aerospace and defense sectors.

  • High-Temperature Co-fired Ceramics (HTCC): HTCC involves printing conductive pastes (containing metals like tungsten or molybdenum) onto a green (unfired) ceramic tape, which is then co-fired at high temperatures. This results in a dense, reliable structure suitable for high-temperature environments.


Ceramic PCB

Common Materials

  • Aluminum Oxide (Al₂O₃): Known for its good dielectric strength and thermal shock resistance, Al₂O₃ is a popular choice for general-purpose ceramic PCBs.

Al2O3

  • Aluminum Nitride (AlN): With higher thermal conductivity than Al₂O₃, AlN is often used in applications requiring better heat management, such as high-power electronics and LED lighting.

Leading Manufacturers

  • Maruwa: A well-established manufacturer known for their advanced ceramic materials and components.


General Dimension



Item

Unit

Type

AN-170

AN-200

AN-230

Dimension

inch(max)

5.5"×7.5"

5.5"×7.5"

5.0"×7.0"

Tolerance

±1% NLT:±0.1㎜

±1% NLT:±0.1㎜

±1% NLT:±0.1㎜

Thickness

0.25~1.5

0.25~1.5

0.25~1.0

Tolerance

±10% NLT:±0.04㎜

±10% NLT:±0.04㎜

±10% NLT:±0.04㎜

Through hole

Φ0.2~

Φ0.2~

Φ0.2~

Tolerance

±0.05㎜

±0.05㎜

±0.05㎜

Warpage

0.002/㎜

0.002/㎜

0.002/㎜









  • Huaqing: A reputable supplier offering a wide range of ceramic PCB solutions tailored to specific customer needs.

Contact Us

If you have any requirements for ceramic PCBs, whether it's for prototyping or mass production, H-CELERITY PCB LIMITED is here to help. Our team of experts will work closely with you to ensure that your custom ceramic PCB meets all your specifications and exceeds your expectations.

For more information or to request a quote, please contact us at sales@h-cpcb.com.


Ceramic Board Materials Classification

Ceramic PCBs utilize different materials to suit specific application requirements. The most commonly used materials include:

  • Aluminum Oxide (Al₂O₃): Known for its good dielectric strength and thermal shock resistance, Al₂O₃ is a popular choice for general-purpose ceramic PCBs.

  • Aluminum Nitride (AlN): With higher thermal conductivity than Al₂O₃, AlN is often used in applications requiring better heat management, such as high-power electronics and LED lighting.

Ceramic Board Production Manufacturing Capabilities

At H-CELERITY PCB LIMITED, we have the capacity to produce ceramic PCBs in both small quantities for prototyping and large volumes for mass production. Our state-of-the-art manufacturing facility is equipped with the latest machinery and tools to ensure consistent quality and precision.

Item

Thick Film Ceramic Board

DBC/DCB Ceramic PCB

DPC  Ceramic PCB

AMB Ceramic PCB

Layer

6 Layer

2 Layer

2 Layer

2 Layer

Max size

200*200mm

138*178mm

138*190mm

114*114mm

Min thickness

0.15mm

0.30mm~0.40mm

0.15mm

0.25mm

Max thickness

6.0mm

1L: 1.3mm; 2L: 1.6mm

6.0mm

1.8mm

conductor thickness

5um-40um

3.9oz-8.6oz

2um-200um

8oz-22.9oz

Min line width/sapcing

6mil/6mil(0.15/0.15mm)

12/12mil (0.30/0.30mm)

3/3mil (0.075/0.075mm)

20/20mil (0.50/0.50mm)

Material

Al2O3,AlN, BeO

Al2O3,AlN,ZrO₂

Al2O3,AlN

AlN,Si₃N₄,ZrO₂


ZrO₂,Si₃N₄

Material thickness

0.25, 0.38, 0.50, 0.635,0.80,1.0, 1.25, 1.5, 2.0mm

0.25, 0.38, 0.50

0.25, 0.38, 0.50, 0.635,    0.80,1.0, 1.25, 1.5, 2.0mm

0.25, 0.38, 0.50,



0.635,0.76, 1.0mm

0.635, 0.76,1.0mm

Min holes

4mil (0.1mm)

Min PAD ring

6mil(0.15mm)

N/A

3mil (0.075mm)

N/A

Min PTH in wall

3mil

N/A

4mil (10um)

N/A

Min pad size

10mil (0.25mm)

8mil (0.20mm)

6mil (0.15mm)

8mil (0.20mm)

Min soldermask bridge

12mil (0.30mm)

8mil (0.20mm)

6mil (0.15mm)

8mil (0.20mm)

Min BGA ball gap

12mil (0.30mm)

8mil (0.20mm)

5mil (0.125mm)

8mil (0.20mm)

PTH/NPTH tolerence

PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)

hole offset tolerance

L/D± 0.1mm/Thk± 0.05mm

outline tolerance

Laser: +0.2/0.05mm;

Laser: +0.2/0.05mm

Laser: +0.2/0.05mm;

Laser: +0.2/0.05mm



Punching: +0.25/0.20mm

Punching: +0.25/0.20mm

Line width/spacing tolerence

± 5mil (0.125mm)

± 5mil (0.125mm)

± 1mil (0.025mm)

± 5mil (0.125mm)

Surface finished

AgPd,AgPt,Au

OSP,Nickel plated, Immersion gold

OSP,ENIG,NiPdAu

OSP,Ni plated,ENIG

thermal stress

1 hour @ 350℃

3 x 10 Sec @ 280 ℃

15 min @ 350 ℃

3 x 10 Sec @ 280 ℃

Our production capabilities include:

  • Advanced Material Handling: Precise handling of ceramic substrates to minimize defects during the manufacturing process.

  • Fine-Line Circuitry: Capable of producing fine-line circuits for high-density interconnect applications.

  • Custom Design Services: Our design team works closely with clients to develop custom solutions tailored to specific requirements.

Ceramic Board Applications

Ceramic PCBs find applications in a wide range of industries, including:

  • Power Electronics: High-power converters, inverters, and power modules.

  • Aerospace & Defense: Radar systems, satellite communication devices, and avionics.

  • Automotive Industry: Electric vehicle power electronics, battery management systems, and sensor technologies.

  • Medical Equipment: Imaging devices, diagnostic equipment, and surgical tools.

  • Telecommunications: RF and microwave components, antennas, and signal processing boards.

Ceramic Board Product Showcase

We offer a comprehensive range of ceramic PCB products, each tailored to meet the unique needs of our clients. Our product lineup includes:

  • Standard Ceramic PCBs: Suited for general applications requiring basic thermal and electrical properties.

  • High-Frequency Ceramic PCBs: Optimized for applications requiring low loss and high-speed signal transmission.

  • High-Power Ceramic PCBs: Designed for applications with high current densities and demanding thermal management requirements.

Contact Us

For all your ceramic PCB needs, H-CELERITY PCB LIMITED is here to help. Our team of experts will work closely with you to ensure that your custom ceramic PCB meets all your specifications and exceeds your expectations.

To learn more about our ceramic PCB solutions or to request a quote, please contact us at sales@h-cpcb.com




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H-CELERITY PCB LIMITED

Specialized in PCB & PCBA manufacture in CHIAN

+86-15816888615
+86-0755-36931652
sales@h-cpcb.com
#A5-A7 Building, Xinbaoye Industrial Park, #2ND Daxing,Shajing Town, Baoan District, Shenzhen-518124.
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