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Ceramic Printed Circuit Boards (PCBs) by H-CELERITY PCB LIMITED

H-CELERITY PCB LIMITED specializes in the manufacture of high-quality Ceramic Printed Circuit Boards (PCBs), which are designed to meet the stringent demands of industries requiring exceptional thermal conductivity, electrical insulation, and mechanical stability. Our ceramic PCBs are engineered using state-of-the-art process technologies and materials to deliver unparalleled performance and reliability.

Key Technologies

Direct Bond Copper (DBC): This technology involves bonding a thin layer of copper directly onto a ceramic substrate using a high-temperature process. DBC is ideal for applications requiring high thermal conductivity and excellent electrical insulation, making it perfect for power electronics and high-power LED applications.
Direct Plated Copper (DPC): Utilizing photolithographic techniques, DPC allows for the precise deposition of copper layers on the ceramic substrate, enabling fine-line circuits and high-frequency performance. This technology is particularly useful in RF and microwave applications.
Active Metal Brazing (AMB): AMB utilizes brazing alloys to join copper to the ceramic substrate, allowing for the creation of complex structures and high-temperature applications. This technology is often used in aerospace and defense sectors.
High-Temperature Co-fired Ceramics (HTCC): HTCC involves printing conductive pastes (containing metals like tungsten or molybdenum) onto a green (unfired) ceramic tape, which is then co-fired at high temperatures. This results in a dense, reliable structure suitable for high-temperature environments.

Ceramic PCB

Common Materials

Aluminum Oxide (Al₂O₃): Known for its good dielectric strength and thermal shock resistance, Al₂O₃ is a popular choice for general-purpose ceramic PCBs.

Al2O3

Aluminum Nitride (AlN): With higher thermal conductivity than Al₂O₃, AlN is often used in applications requiring better heat management, such as high-power electronics and LED lighting.

Leading Manufacturers

Maruwa: A well-established manufacturer known for their advanced ceramic materials and components.

General Dimension

Item	Unit	Type
		AN-170	AN-200	AN-230
Dimension	inch(max)	5.5"×7.5"	5.5"×7.5"	5.0"×7.0"
	Tolerance	±1% NLT:±0.1㎜	±1% NLT:±0.1㎜	±1% NLT:±0.1㎜

Thickness	㎜	0.25~1.5	0.25~1.5	0.25~1.0
	Tolerance	±10% NLT:±0.04㎜	±10% NLT:±0.04㎜	±10% NLT:±0.04㎜

Through hole	㎜	Φ0.2~	Φ0.2~	Φ0.2~
	Tolerance	±0.05㎜	±0.05㎜	±0.05㎜

Warpage	㎜	0.002/㎜	0.002/㎜	0.002/㎜

Huaqing: A reputable supplier offering a wide range of ceramic PCB solutions tailored to specific customer needs.

Contact Us

If you have any requirements for ceramic PCBs, whether it's for prototyping or mass production, H-CELERITY PCB LIMITED is here to help. Our team of experts will work closely with you to ensure that your custom ceramic PCB meets all your specifications and exceeds your expectations.

For more information or to request a quote, please contact us at sales@h-cpcb.com.

Ceramic Board Materials Classification

Ceramic PCBs utilize different materials to suit specific application requirements. The most commonly used materials include:

Aluminum Oxide (Al₂O₃): Known for its good dielectric strength and thermal shock resistance, Al₂O₃ is a popular choice for general-purpose ceramic PCBs.
Aluminum Nitride (AlN): With higher thermal conductivity than Al₂O₃, AlN is often used in applications requiring better heat management, such as high-power electronics and LED lighting.

Ceramic Board Production Manufacturing Capabilities

At H-CELERITY PCB LIMITED, we have the capacity to produce ceramic PCBs in both small quantities for prototyping and large volumes for mass production. Our state-of-the-art manufacturing facility is equipped with the latest machinery and tools to ensure consistent quality and precision.

Item	Thick Film Ceramic Board	DBC/DCB Ceramic PCB	DPC Ceramic PCB	AMB Ceramic PCB
Layer	6 Layer	2 Layer	2 Layer	2 Layer
Max size	200*200mm	138*178mm	138*190mm	114*114mm
Min thickness	0.15mm	0.30mm~0.40mm	0.15mm	0.25mm
Max thickness	6.0mm	1L: 1.3mm; 2L: 1.6mm	6.0mm	1.8mm
conductor thickness	5um-40um	3.9oz-8.6oz	2um-200um	8oz-22.9oz
Min line width/sapcing	6mil/6mil（0.15/0.15mm）	12/12mil (0.30/0.30mm)	3/3mil （0.075/0.075mm）	20/20mil (0.50/0.50mm)
Material	Al2O3，AlN, BeO	Al2O3，AlN，ZrO₂	Al2O3，AlN	AlN，Si₃N₄,ZrO₂

			ZrO₂，Si₃N₄
Material thickness	0.25, 0.38, 0.50, 0.635,0.80,1.0, 1.25, 1.5, 2.0mm	0.25, 0.38, 0.50	0.25, 0.38, 0.50, 0.635, 0.80,1.0, 1.25, 1.5, 2.0mm	0.25, 0.38, 0.50,

		0.635，0.76, 1.0mm		0.635, 0.76,1.0mm
Min holes	4mil (0.1mm)
Min PAD ring	6mil（0.15mm）	N/A	3mil (0.075mm)	N/A
Min PTH in wall	3mil	N/A	4mil (10um)	N/A
Min pad size	10mil (0.25mm)	8mil (0.20mm)	6mil (0.15mm)	8mil (0.20mm)
Min soldermask bridge	12mil (0.30mm)	8mil (0.20mm)	6mil (0.15mm)	8mil (0.20mm)
Min BGA ball gap	12mil (0.30mm)	8mil (0.20mm)	5mil (0.125mm)	8mil (0.20mm)
PTH/NPTH tolerence	PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
hole offset tolerance	L/D± 0.1mm/Thk± 0.05mm
outline tolerance	Laser: +0.2/0.05mm;	Laser: +0.2/0.05mm	Laser: +0.2/0.05mm;	Laser: +0.2/0.05mm

	Punching: +0.25/0.20mm		Punching: +0.25/0.20mm
Line width/spacing tolerence	± 5mil (0.125mm)	± 5mil (0.125mm)	± 1mil (0.025mm)	± 5mil (0.125mm)
Surface finished	AgPd,AgPt,Au	OSP,Nickel plated, Immersion gold	OSP,ENIG,NiPdAu	OSP,Ni plated,ENIG
thermal stress	1 hour @ 350℃	3 x 10 Sec @ 280 ℃	15 min @ 350 ℃	3 x 10 Sec @ 280 ℃

Our production capabilities include:

Advanced Material Handling: Precise handling of ceramic substrates to minimize defects during the manufacturing process.
Fine-Line Circuitry: Capable of producing fine-line circuits for high-density interconnect applications.
Custom Design Services: Our design team works closely with clients to develop custom solutions tailored to specific requirements.

Ceramic Board Applications

Ceramic PCBs find applications in a wide range of industries, including:

Power Electronics: High-power converters, inverters, and power modules.
Aerospace & Defense: Radar systems, satellite communication devices, and avionics.
Automotive Industry: Electric vehicle power electronics, battery management systems, and sensor technologies.
Medical Equipment: Imaging devices, diagnostic equipment, and surgical tools.
Telecommunications: RF and microwave components, antennas, and signal processing boards.

Ceramic Board Product Showcase

We offer a comprehensive range of ceramic PCB products, each tailored to meet the unique needs of our clients. Our product lineup includes:

Standard Ceramic PCBs: Suited for general applications requiring basic thermal and electrical properties.
High-Frequency Ceramic PCBs: Optimized for applications requiring low loss and high-speed signal transmission.
High-Power Ceramic PCBs: Designed for applications with high current densities and demanding thermal management requirements.

Contact Us

For all your ceramic PCB needs, H-CELERITY PCB LIMITED is here to help. Our team of experts will work closely with you to ensure that your custom ceramic PCB meets all your specifications and exceeds your expectations.

To learn more about our ceramic PCB solutions or to request a quote, please contact us at sales@h-cpcb.com

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